Semiconductor Classification Checklist (Advanced Computing & Manufacturing Equipment, Japan + US EAR, 2026)

A fill-in checklist for advanced-computing ICs (3A090, 4A090, HBM) and semiconductor manufacturing equipment (SME, 3B-series), classifying from both Japan (Appended Table 1 Row 7 + the goods ordinance) and the US EAR (ECCN, TPP/PD thresholds, Country Group D:5, 744.23, FDP, License Exceptions). With a plain-language intro. Based on primary sources (15 CFR, the Federal Register, e-Gov, METI); semiconductor controls change fastest, so treat the current text plus BIS/METI and your export-control officer as authoritative.